|Disruptive Engineering is about technologies that will drive the electronics industry this year. The blog features your nominations of enabling technologies and applications that you believe could change the way we work or play, or something that you think will affect most electronics projects in 2013.|
2013 - Jan.
Posted: 04:23:54 PM, 11/01/2013
3D IC manufacturing gets ready for "prime time"
In 2012, technology for 3D IC integration and packaging has not only moved from 'lab to fab,' but is on the cusp of high volume commercial manufacturing of a first wave of 3D IC products in 2013 and beyond. A convergence of economic, market and technology forces has led to 3D IC technology breakthroughs by global semiconductor leaders, including Intel, IBM, Micron, Qualcomm, Samsung, ST-Microelectronics and Xilinx.
In a quest to leap ahead of Moore's Law to address growing demand for smarter, more highly integrated, lower power electronic systems for myriad applications—driven by the so-called "Internet of Things"—a short list of companies is proving the viability of 3D IC manufacturing based upon through silicon via (TSV) technology and leveraging brand new supply chain models.
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