|Disruptive Engineering is about technologies that will drive the electronics industry this year. The blog features your nominations of enabling technologies and applications that you believe could change the way we work or play, or something that you think will affect most electronics projects in 2013.|
2013 - Jan.
Universal Serial Bus (USB) is ubiquitous. What if you were given an option to just carry a USB cable, as against a bunch of power adapters to charge your tablet, ultrabook and smartphone? Sounds too good to be true, right?
In August 2012 USB Implementers Forum (the governing body for USB Standard) released a specification—USB Power Delivery (USB PD) that will allow up to 100W of power to be delivered over USB’s power pin!
The new standard (USB PD) allows interconnected devices to negotiate power requirements, and allows devices with abun......
In 2012, technology for 3D IC integration and packaging has not only moved from 'lab to fab,' but is on the cusp of high volume commercial manufacturing of a first wave of 3D IC products in 2013 and beyond. A convergence of economic, market and technology forces has led to 3D IC technology breakthroughs by global semiconductor leaders, including Intel, IBM, Micron, Qualcomm, Samsung, ST-Microelectronics and Xilinx.
In a quest to leap ahead of Moore's Law to address growing demand for smarter, more highly integrated, lower power electronic system......
The PSi C-Scale LED engine is a disruptive technology for high brightness LED applications. It caters to the growing demand of reliable, energy efficient LED lighting solutions in a unique way.
The C-Scale LED engine is the only solution available using only bare copper to conduct heat away from the LED and, at the same time, enable the electrical connectivity of anode and cathode of the LED using highly automated semiconductor assembly processes.
The C-Scale engine defines high brightness on top of the current scale. A 90lm/W light output has been achieved using standard......
Cadence this year is nominating the FinFET, a new type of 3D transistor that promises significant power and performance advantages over the planar devices that are in common use today. FinFETs are now expected to come into common use at process nodes below 20nm, where they will allow semiconductor and systems companies to continue to develop commercially viable chips for the mobile devices that are dominating the consumer market. FinFETs will thus enable new generations of high-density, high-performance and ultra-low-power systems on chip (SoCs) for future smart phones, tablets a......
EE Times Asia is going around asking engineers like yourself to talk about a technology or an application of a technology that you feel will affect us the most—the way we work, play and live our lives.
To get the ball rolling, I decided to first post my nomination and realized that it's not an easy task. If you get starry-eyed like me reading about the latest from the labs or pine for the newest gizmo, the job just gets tougher.
I've had to put aside a breakthrough in genetic engineering that's created the first coconut-flavoured pineapp......
Posted:07/12/12 10:32 AM
• Robotics passion inspires Android c...
Posted:29/11/12 04:38 PM
Posted:05/03/13 05:10 PM
• Is Ada prepped for mainstream embed...
Posted:26/02/13 08:38 PM
Posted:05/03/13 05:22 PM
• Is a RIM comeback possible?
Posted:08/02/13 06:49 PM
Posted:22/11/12 08:56 PM
• Understand initialization of polymo...
Posted:24/10/12 06:16 PM
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