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Power MOSFET package slims down
Posted: Feb 25, 2008 1:30 PM

Toshiba America Electronic Components Inc.'s (TAEC) second-generation Smart Thin Package (STP2) surf...[ View complete article ]


Message: Power MOSFET package slims down Post time: Feb 25, 2008 1:30 PM
 

Author: Halvadvala

Level: Interns

Points: 129

Toshiba America Electronic Components Inc.'s (TAEC) second-generation Smart Thin Package (STP2) surface-mount packaging for power MOSFETs, which is 20 percent smaller than the original, is now available.
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( 1 ) Reply:Power MOSFET package slims down Post time: Feb 25, 2008 1:30 PM
 

Author: Halvadvala

Level: Interns

Points: 129

Hi- it very good can we have evaluation sample
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( 2 ) Reply:Power MOSFET package slims down Post time: Feb 26, 2008 3:12 PM
 

Author: ForumWatch

Level: Interns

Points: 155

Toshiba India's email address: contact@toshiba-india.com.
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