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Confab stresses potential thermal crisis in IC design
Posted: Jul 4, 2008 8:59 AM

At the Design Automation Conference in Anaheim, California, an educational panel addressed the therm...[ View complete article ]


Message: Confab stresses potential thermal crisis in IC design Post time: Jul 4, 2008 8:59 AM
 

Author: Maynard Delfin

Level: Interns

Points: 400

At the Design Automation Conference in Anaheim, California, an educational panel addressed the thermal issue in IC design. Two key questions raised were when will this issue be emerging as a crucial concern? What are the solutions to solve this potential crisis?
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( 1 ) Reply:Confab stresses potential thermal crisis in IC design Post time: Jul 4, 2008 8:59 AM
 

Author: Maynard Delfin

Level: Interns

Points: 400

Before this potential crisis gets out of the way, several precautionary measures must be prepared to lighten the burden. Initial steps to reduce power consumption per function through smart process design, die design and software optimization must be established.
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